Asetek today announced an order from a new channel partner to service demand from a new OEM customer for an undisclosed HPC (High Performance Computing) installation. All parties remain undisclosed at this time.

“Adding OEMs has been a key goal for our datacenter business and it is particularly satisfying to add another significant OEM to our portfolio of customers,” said André Sloth Eriksen, CEO and founder of Asetek. “This order confirms our ability to leverage our leading position in the HPC segment to attract new customers as well as end-users.”  

The order is for Asetek’s RackCDU D2C™ (Direct-to-Chip) liquid cooling solution and is valued at USD 120,000. Delivery in the second half of 2017.