At the 2015 International Consumer Electronics Show (CES), Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, announced a range of new innovations optimized to enhance connectivity in the home, on-the-go and on-the-road. New product announcements include the world's first DOCSIS 3.1 offering, new small form factor set-top box platforms and the world's fastest 4x4 Multi-user
Broadcom Introduces Industry's Most Power Efficient Automotive Ethernet Chip
- Next-generation BroadR-Reach® Technology Extends Ethernet to Telematics, Shark Fin Antennas and Instrumentation Cluster Applications
Broadcom Grows Connected Car Portfolio With Automotive Near Field Communication Chip
- Tap-to-Connect Technology Delivers Seamless In-car Device Pairing
Broadcom Expands Low-power ODU Satellite Device Portfolio
- Enables Operators to Expand Subscribers and Services Offered Within Multiple Dwelling Units
Broadcom Announces New 5G WiFi Chips and SoCs for Routers, Gateways and Set-top Boxes
- World's Fastest 4x4 MU-MIMO Chip Delivers Dramatic Improvement in Wireless Video Streaming
Broadcom Enables New Denon Google Cast™ Ready Multi-room Wireless Sound System
- Delivers Seamless Whole Home Audio Streaming over Wi-Fi
Broadcom Debuts Multi-standard Ultra HD Chip Family
- First Set-top Box SoCs to Integrate Google VP9 Video Compression Standard
Broadcom Unleashes Gigabit Speeds for Consumer Cable Modems
Announces World's First DOCSIS 3.1 Chip and Cable Modem Reference Design to Increase Wireless Reach and Range inAny Room
Broadcom Develops Ultra-compact Set-top Box Platform With Integrated 4x4 Wi-Fi
- Brings 5G WiFi and HEVC Compression to Platforms Smaller Than a Smartphone
D-Link Selects Broadcom's HomePlug® AV2 Technology for New AV2 2000 High Speed Powerline Adapter
- First HPAV2
MIMO -certified Device Extends Home Networks over Existing Power Lines
- Enables Cable MSOs to Provide Faster Customized Data Services
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