Asetek® announced today that it has received a purchase order for its RackCDU™ data center liquid cooling system placed by one of its Original Equipment Manufacturing (OEM) partners. The order is a repeat order for use in a High Performance Computing (HPC) cluster at an undisclosed university.        

A total of 5 RackCDUs with cooling loops for a total of 280 compute nodes will be purchased for use in the HPC cluster. The liquid cooling loops will cool and remove all heat from the processors, co-processors, and memory. The loops will ensure the cluster maintains maximum energy efficiency and performance while keeping operating costs at a minimum.       

“It is always satisfying fulfilling a new order, but it is particular rewarding for this to be for a returning end user that is already using our systems on a daily basis and knows what to expect,” said André Sloth Eriksen, Founder and CEO of Asetek. “As this is our fourth order in a relatively short period of time to be used in a university data center, it confirms our earlier prediction that the educational segment is one that can benefit greatly from Asetek’s solutions.“       

RackCDU is Asetek’s innovative hot water, direct-to-chip, data center liquid cooling technology, which removes heat from CPUs, GPUs, memory modules and other hot spots within the servers with an all-liquid path and rejects it into ambient outdoor air without chilling. As validated by Lawrence Berkeley National Labs, RackCDU enables cooling savings in excess of 50%, density increases of 2.5x to 5x, and recovery of all the server energy removed by RackCDU for reuse in facility heating and cooling.