Asetek® announced today its second order for its RackCDU™ data center liquid cooling solution placed by one of its Original Equipment Manufacturing (OEM) partners for use in an undisclosed Japanese University. A total of 5 RackCDUs with cooling loops, for a total of 385 compute nodes, will be purchased for use in the HPC cluster. Delivery will occur in the first quarter of 2014.

“Needless to say, we are excited to receive our second order only a few weeks after receiving our first commercial OEM order for our RackCDU,” said André Sloth Eriksen, Founder and CEO of Asetek. “Building a solid pipeline with a new technology through an OEM business model takes time, but we have had a very successful Super Computing convention this week with more than 600 registered visitors showing solid interest from both data center operators as well as OEMs. This order confirms the feedback we have gotten on the show floor.”

RackCDU is Asetek’s innovative hot water, direct-to-chip, data center liquid cooling technology, which removes heat from CPUs, GPUs, memory modules and other hot spots within the servers with an all-liquid path and rejects it into ambient outdoor air without chilling. As validated recently by Lawrence Berkeley National Labs, RackCDU enables cooling savings in excess of 50%, density increases of 2.5x to 5x, and recovery of all the server energy removed by RackCDU for reuse in facility heating and cooling.