In Win Development Inc. (InWin) announces the COVALENT full-tower chassis, engineered for high-performance computing, AI applications, and professional workstation environments. Built on a modular architecture with expansive internal capacity, COVALENT combines efficient thermal engineering with a refined industrial aesthetic to support sustained, high-demand workloads.

Balanced Design for Performance and Versatility

COVALENT is available with either tempered glass or solid metal side panel options. The tempered glass edition highlights internal components and ARGB lighting, while the metal panels offer a more understated appearance with enhanced structural strength and thermal performance. A vertically slotted front panel improves airflow intake, helping maintain consistent cooling during extended workloads.

Built for Workstation Platforms and Multi-GPU Configurations

COVALENT supports back-connect and EEB (12" × 13") motherboards, making it well-suited for workstation class builds. Its spacious interior accommodates multiple high-end GPUs and storage while preserving efficient airflow management.

With eight PCIe slots, the chassis enables both horizontal and vertical GPU installation. Reinforced steel construction, along with optional GPU support brackets, ensures long-term stability during continuous operation.

Optimized Thermal and Structural Design for AI and HPC

Designed for demanding AI and high-performance computing environments, COVALENT features an airflow-optimized layout supporting up to dual 420 mm radiators and as many as 13 fans. Four pre-installed CV140 fans (three front, one rear) provide balanced cooling, maintaining stable thermal performance in multi-GPU or high-power configurations.

Modular Space and Professional-Grade Features

COVALENT supports flexible storage for 3.5" and 2.5" devices, with expandability enabled through optional brackets. Its modular internal layout adapts to a variety of workloads. Additional features include a dedicated PSU chamber, tool-free panels, USB 3.2 Gen 2x2 Type-C front I/O, and integrated fan hub with cable management support for a clean build.