Micron Technology, Inc., (Nasdaq:MU) today announced that it's demonstrating new innovations for the Connected World at the electronica show in the Micron booth, Hall A6, Booth 121.


With the rise of the Internet of Things (IoT), there will be more than 50 billion devices connected to the Internet by 2025 - all capturing, analyzing and transmitting more and more data to the cloud and relying on real-time big data analytics to drive decisions. Memory and Storage technologies are at the center of enabling these new applications. Micron is expanding its broad portfolio with exciting new additions and enabling innovative IoT applications across Connected City/Industry, Connected Car and Connected Home.

"The number of connected devices is exploding everywhere, from inside cars and consumer devices to healthcare and industrial systems. Combine that with the growing sophistication of apps and services, and it's easy to see why demand for memory is on the rise," said Mike Feibus, principal analyst of TechKnowledge Strategies. "Micron is benefiting from the trend because it's a leader in memory technology, and because it possesses the system-level expertise needed to ensure that devices are outfitted with the right memory implementation."

The Connected World encompasses far more than devices and sensors. It will require networks and data centers that are scalable and optimized for the increased volume of IoT traffic. Micron's memory solutions are driving the Connected World across each of these key segments that are part of delivering on the IoT promise.  


"It's an amazing time to be an embedded products and solutions company. This is an age of innovation where everything is becoming smarter, exchanging real-time information about users, environment and physical infrastructure and assets, leading to new products and business models," said Jeff Bader, vice president of Micron's Embedded Business. "The new additions to our embedded portfolio continue to bring our customer high performance and reliability in a wide range of form factors, enabling them to choose the memory technology that best meets their IoT application requirements." 

Micron New Embedded Product Announcements


Last week, Micron announced several new products to its embedded portfolio to provide product designers with an expanded range of technologies, performance and form factors that are ideal for the Connected World.

• Micron Announces Wide Range of Both NAND and NOR Plus RAM MCPs (Multi-Chip Packages)
  NAND and NOR MCPs for M2M applications

o High-performance MCP solutions in a wide range of technologies, densities and form factors
o Reliability for rugged, extreme-temperature and mission-critical environments
o Support for long-life embedded designs

• Micron Announces Next-Generation Storage Solutions for Demanding Automotive Applications
  Automotive SSD

o Industry's first automotive-grade Solid State Drive (SSD) containing AEC-Q100-compliant NAND flash memory components
o Higher performance enables nearly instantaneous system response times and fast application loading
o Hardware-based encryption, data protection against unexpected power loss and adaptive thermal monitoring system

Automotive eMMC 5.0

o Full range of JEDEC compliant packages in densities ranging from 4GB to 128GB
o Optimized for navigation and infotainment applications such as detailed maps with full 3D and building information, traffic monitoring, meteorological information, car radio and multimedia, satellite radio, E-call and voice recognition

On Display with Micron at electronica

Micron will be demonstrating a number of memory technology innovations at electronica for a wide range of IoT applications supporting the Connected Car, Connected City and Connected Home markets. To learn more, be sure to visit our booth in Hall A6, Booth 121, in the electronica Embedded Systems and Automotive Hall or go to http://www.micron.com/embedded.