Asetek® (ASETEK.OL) will showcase its latest HPC and energy saving data center liquid cooling solutions at High Performance Computing for Wall Street in New York City at the Roosevelt Hotel on September 22, 2014. Servers and blades from a variety of server manufactures will be on display, including those used by Cray® in its CS-300LC™ liquid cooled cluster supercomputer. Asetek’s technology will be on display at booth # 318.       

Asetek’s RackCDU™ range includes RackCDU D2C™ (Direct-to-Chip) and RackCDU ISAC™ (In-Server Air Conditioning). RackCDU D2C captures up to 80% of server heat, enabling 2.5x-5x increases in data center compute density. RackCDU ISAC captures nearly 100% of server heat and enables operation without concern for data center air quality.        

“Asetek understands the performance demands required of quantitative investing and trading in the financial industry. These demands, along with the cost of energy, makes our solutions particularly compelling for those seeking a competitive advantage,” said André Sloth Eriksen, Founder and CEO of Asetek.       

This HPC for Wall Street conference is focused on High Put-through, Low Latency, Networks, Data Centers, and lowering costs of operation. Appointments for in-depth discussions about Asetek’s data center liquid cooling solutions at the event may be scheduled by sending an email to This email address is being protected from spambots. You need JavaScript enabled to view it..